The demand for high-speed processing and big data has accelerated the adoption of three-dimensional integrated circuits (3D ICs), where interposers serve as essential components for chip-to-chip connectivity. However, silicon interposers using the through-silicon via (TSV) technology have structural limitations. As alternatives, glass-based interposers employing the through-glass via (TGV) technology are gaining attention. This study explored the fabrication of via holes in glass substrates using the selective laser etching (SLE) process. A spatial light modulator (SLM) was used to generate donut- shaped bessel beams by inserting an image pattern without relying on phase modulation. The machinability of via holes fabricated with these beams was compared to that of holes formed using phase-modulated beams. Effect of pulse energy on taper angle was also investigated. Hourglass-shaped holes were observed at lower pulse energies. However, taper angles approaching 90° were observed at higher energies, indicating an improved verticality.

The tungsten carbide is a material with high hardness, wear resistance, good chemical stability, and dimensional stability. Because of these characteristics, it is mainly used as a tool for cutting and molding such as molds, and casts required for manufacturing high value-added equipment such as automobile parts and medical equipment. However, it is difficult to process with the traditional machining methods because of the high toughness and hardness. To overcome these problems, a study of tungsten carbide machining processing using the ultrafast-laser was recently conducted. In this paper, the ultrafast lasers with the pulse duration of 190 fs, 5 and 10 ps, respectively, were used. When the experiments were conducted with pulse widths of 5 and 10 ps, respectively, micro-cracks were observed from the heat generated by the overlap of the laser pulses. Conversely, the machining processing using a laser with the pulse width of 190 fs showed a major advantage with no crack by minimizing the thermal effects.