This study experimentally investigates the laser-assisted diamond turning of high-hardness sapphire to enhance its precision machinability for defense optical components. Sapphire is an attractive material for applications such as transparent armor, sensor windows, and optical apertures due to its excellent mechanical strength, thermal and wear resistance, and outstanding optical transparency. In this research, precision cutting tests were performed on a diamond turning machine, and the resulting surfaces were characterized using a white-light interferometric profilometer. At an optimal laser power of 5 W, the surface roughness and form accuracy improved to 28.8 nm Ra and 191 nm RMS, respectively, demonstrating that laser assistance can significantly enhance surface quality. Microscopic observations after processing revealed a noticeable reduction in tool wear under laser-assisted conditions, which is likely to improve process stability and extend tool life. However, both insufficient and excessive laser power resulted in degraded surface quality compared to conventional turning, underscoring the importance of optimizing laser power. These findings highlight the potential for process optimization in laser-assisted diamond turning to improve the precision and reliability of sapphire machining, contributing to the future development of advanced manufacturing technologies for high-precision defense components.
Germanium, an optical material, has high transmittance and refractive index and low light scattering in the infrared region, and research is being conducted to utilize it in various industrial fields. Various forms of optical lenses can be subjected to ultra-precision machining with high quality surface roughness, and they form accuracy through single point diamond turning (SPDT). In particular, the diamond tool with a negative rake angle and the u-LAM process that applies a 1,064 nm laser to the material have been studied to fabricate brittle materials into optical lenses. In this study, the effects of process parameters, such as laser power (W), spindle speed (RPM), feed rate (mm/min), and depth of cut (μm), on the surface roughness of a sub-nanometer scale and the occurrence of defects during the machining process were analyzed for Germanium materials. The process of removing these defects was also analyzed.
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