Skip to main navigation Skip to main content
  • E-Submission

JKSPE : Journal of the Korean Society for Precision Engineering

OPEN ACCESS
ABOUT
BROWSE ARTICLES
EDITORIAL POLICIES
FOR CONTRIBUTORS

Page Path

2
results for

"재료 제거율"

Article category

Keywords

Publication year

Authors

"재료 제거율"

Articles
Micro Hole Machining Characteristics of Glassy Carbon Using Electrical Discharge Machining (EDM)
Jae Yeon Kim, Ji Hyo Lee, Bo Hyun Kim
J. Korean Soc. Precis. Eng. 2025;42(4):325-332.
Published online April 1, 2025
DOI: https://doi.org/10.7736/JKSPE.025.006
Glassy carbon (GC) has superior properties such as high corrosion resistance, heat resistance, and low adhesion to glass materials in a glass molding process (GMP). In addition, the demand for GC molds is increasing in various industries that require high precision of glass parts. However, GC is a difficult-to-machine material with high hardness and brittleness. Electrical discharge machining (EDM) can machine GC regardless of its strength or hardness. In this study, tungsten carbide (WC-Co) electrode was fabricated by wire electrical discharge grinding (WEDG). Characteristics of EDM of micro holes on GC were then analyzed. As capacitance and voltage increased, material removal rate (MRR) increased while machining time tended to decrease. However, at low voltages, short circuit and secondary discharge occurred, which increased the electrode wear rate (EWR). As a result, a D-shaped electrode that could prevent short circuit and debris accumulation was fabricated and a micro hole array was machined.

Citations

Citations to this article as recorded by  Crossref logo
  • Experimental Study on the Formation of Discharge Crater Morphology in Micro EDM
    Jae Yeon Kim, Ui Seok Lee, Hee Jin Kong, Bo Hyun Kim
    Journal of the Korean Society for Precision Engineering.2026; 43(1): 61.     CrossRef
  • 67 View
  • 6 Download
  • Crossref
Prediction of CMP Material Removal Rate based on Pad Surface Roughness Using Deep Neural Network
Jong Min Jeong, Seon Ho Jeong, Yeong Il Shin, Young Wook Park, Hae Do Jeong
J. Korean Soc. Precis. Eng. 2023;40(1):21-29.
Published online January 1, 2023
DOI: https://doi.org/10.7736/JKSPE.022.119
As the digitization of the manufacturing process is accelerating, various data-driven approaches using machine learning are being developed in chemical mechanical polishing (CMP). For a more accurate prediction in contact-based CMP, it is necessary to consider the real-time changing pad surface roughness during polishing. Changes in pad surface roughness result in non-uniformity of the real contact pressure and friction applied to the wafer, which are the main causes of material removal rate variation. In this paper, we predicted the material removal rate based on pressure and surface roughness using a deep neural network (DNN). Reduced peak height (Rpk) and real contact area (RCA) were chosen as the key parameters indicative of the surface roughness of the pad, and 220 data were collected along with the process pressure. The collected data were normalized and separated in a 3 : 1 : 1 ratio to improve the predictive performance of the DNN model. The hyperparameters of the DNN model were optimized through random search techniques and 5 cross-validations. The optimized DNN model predicted the material removal rate with high accuracy in ex-situ CMP. This study is expected to be utilized in data-driven machine learning decision making for cyber-physical CMP systems in the future.

Citations

Citations to this article as recorded by  Crossref logo
  • Precision Engineering and Intelligent Technologies for Predictable CMP
    Somin Shin, Hyun Jun Ryu, Sanha Kim, Haedo Jeong, Hyunseop Lee
    International Journal of Precision Engineering and Manufacturing.2025; 26(9): 2121.     CrossRef
  • Prediction of Normalized Material Removal Rate Profile Based on Deep Neural Network in Five-Zone Carrier Head CMP System
    Yonsang Cho, Myeongjun Kim, Munyoung Hong, Joocheol Han, Hong Jin Kim, Hyunki Kim, Hyunseop Lee
    International Journal of Precision Engineering and Manufacturing-Green Technology.2025; 12(3): 869.     CrossRef
  • 聚氨酯抛光垫特性对化学机械抛光性能的影响研究进展(特邀)
    侯长余 HOU Changyu, 吴涛 WU Tao, 李凯强 LI Kaiqiang, 周平 ZHOU Ping, 郭东明 GUO Dongming
    Infrared and Laser Engineering.2025; 54(9): 20250336.     CrossRef
  • 94 View
  • 8 Download
  • Crossref