MXene is one of the most fascinating 2D materials owing to its great electrical properties and unique performance. Among various application areas, the performance of organic material adsorption has been highlighted with the growing interest in the biocompatible applications of MXene. Although previous research revealed that the huge surface area of this 2D nanomaterial could lead to superior organic material adsorption performance, surface functional groups were usually controlled by changing the pH, and the MXene was generally produced by HF etchant. In this study, a surface modification method of Ti₃C₂T_x MXene film was proposed to enhance organic material adsorption by irradiating the pulsed plasma electron beam (EB). Methylene blue (MB)-dispersed DI water was prepared, and pristine MXene was prepared at pH 7. The MB concentration was only reduced by 20% by pristine MXene. However, EB-treated MXene adsorbed about 75% of the MB within 20 min and over 90% within 80 min when the MXene film was ground to powder form. The results showed that the increased surface area and formation of hydrophilic functional groups successfully modified MB adsorption following EB irradiation under optimal processing conditions.

E-Beam micro-hole drilling features high productivity of 2,000 holes per second and a high aspect ratio of 10 (depth/diameter). It can be used for the fabrication of nozzles and filters that require several holes. The hole-formation mechanism comprises 1) melting the sample by the energy exchange of e-beam and 2) removing the molten sample by the explosion of the backing material. Accordingly, hole-formation mechanism studies have focused on the effectiveness of backing material and the workpiece’s melting characteristic. This study investigated the melting depth characteristics depending on the beam current and exposure time that determines the E-Beam dose. The experiments were conducted without using the backing materials with an aim to investigate the melting characteristic of the workpiece itself. The results showed that the increase in the exposure current led to an improvement in the melting depth. The results were verified based on the comparison with the results of the process involving the backing material.

Metal additive manufacturing using electron beam melting (EBM) process applies electron beam for heating, sintering, and melting of powders to fabricate a three-dimensional component. The component may contain residual porosity internally and may be subjected to poor surface finish externally. To improve the quality of the surface finish and densification, re-melting is conducted. The purpose of this paper was to estimate the appropriate process conditions for a plasma electron beam remelting process using heat transfer finite element analyses (FEAs). The impact of the travel speed of table and thickness of the deposited part on temperature distributions were examined. The size of molten pool was estimated from the results of the thermal FEA. From the estimated size of molten pool, the travel speed of table and the hatch spacing between remelting tracks are discussed and selected as the appropriate process conditions for electron beam re-melting process from the perspective of minimum overlapping region of the molten pool.