The need for large-area cross-sectional analysis with nanometer precision is rapidly growing in various advanced manufacturing sectors. Traditional focused ion beam (FIB) techniques are too slow for milling millimeter-scale volumes. They often introduce ion implantation, redeposition, and curtaining effect, which ultimately prevent effective large-area processing and analysis. To overcome these limitations, we developed a hybrid machining process integrating femtosecond laser micromachining for rapid roughing with FIB milling for precision finishing. Angle of incidence (AOI) control during laser machining was employed to minimize the taper angle of laser-ablated sidewalls, thereby significantly reducing subsequent FIB milling volume. Using a 1030 nm, 350 fs laser, we achieved nearly vertical sidewalls (taper angle: ~2.5° vs. ~28° without AOI control) in silicon. Raman spectroscopy revealed a laser-affected zone extending about 2 μm perpendicular to the sidewall, indicating the need for further FIB milling besides laser-tapered regions to remove laser-induced damage. On multilayer ceramic capacitors and micropillar fabrication, the hybrid laser-FIB method achieved efficient large-area cross sections with preserved microscale details. We present the development of an integrated triple-beam system combining laser, plasma FIB, and SEM, capable of fast volume removal and nanoscale imaging in one equipment. This approach can markedly improve throughput for large-area cross-sectional analysis.

To increase the reliability and positional accuracy of a machine tool, a novel capacitive displacement sensor having a cylindrical shape is presented to measure the axial displacement of a machine tool spindle. Characteristics of the sensor were analyzed by numerical simulation. The sensor was built into a specific machine tool spindle and its performance was experimentally investigated. The accuracy of a thermal error compensation system of a machine tool can be enhanced greatly using proposed sensor.

The scanning electron microscope (SEM) contains an electron optical system in which electrons are emitted and moved to form a focused beam, and generates secondary electrons from the specimen surfaces, eventually making an image. The electron optical system usually contains two condenser lenses and an objective lens. The condenser lenses generate a magnetic field that forces the electron beams to form crossovers at desired locations. The objective lens then focuses the electron beams on the specimen. The present study covers the design and analysis of an objective lens for a thermionic SEM. A finite element (FE) analysis for the objective lens is performed to analyze its magnetic characteristics for various lens designs. Relevant beam trajectories are also investigated by tracing the ray path of the electron beams under the magnetic fields inside the objective lens.