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"Hot-embossing process"

Article
Fabrication of PMMA Acoustophoretic Microfluidic Chip Using Plasma Assisted Bonding
Ryu Ri Yoon, Sung Man Kim, Arum Han, Young Hak Cho
J. Korean Soc. Precis. Eng. 2017;34(5):343-347.
Published online May 1, 2017
DOI: https://doi.org/10.7736/KSPE.2017.34.5.343
In this paper, we propose a simple and low-cost fabrication method for PMMA (Poly (Methyl Methacrylate)) acoustophoretic microfluidic chips using plasma-assisted bonding followed by MEMS (Microelectromechanical Systems) processes. A metal mold for replicating the PMMA polymer was fabricated using MEMS processes, and the microfluidic channel was imprinted on the PMMA polymer using a hot-embossing process. The closed fabricated microfluidic channel was achieved by means of the plasma-assisted bonding between the PMMA channel and the flat PMMA cover. The plasma treatment and hot-embossing conditions for PMMA-PMMA bonding were studied and evaluated. The particle separation test confirmed that the PMMA acoustophoretic microfluidic chips could be used. We expect the Si-based acoustophoretic microfluidic chip to be replaced by the presented polymer chip in such applications as blood or droplet separation.

Citations

Citations to this article as recorded by  Crossref logo
  • Fabrication of Acoustophoretic Device with Lateral Polymer Wall for Micro-Particle Separation
    Sungdong Kim, Su Jin Ji, Song-I Han, Arum Han, Young Hak Cho
    Journal of the Korean Society for Precision Engineering.2022; 39(5): 379.     CrossRef
  • Microfluidic Chip Fabrication of Fused Silica Using Microgrinding
    Pyeong An Lee, Ui Seok Lee, Dae Bo Sim, Bo Hyun Kim
    Micromachines.2022; 14(1): 96.     CrossRef
  • PMMA Thermal Bonding System Using Boiling Point Control
    Dong Jin Park, Taehyun Park
    Journal of the Korean Society for Precision Engineering.2021; 38(8): 613.     CrossRef
  • Microchannel Fabrication on Glass Materials for Microfluidic Devices
    Jihong Hwang, Young Hak Cho, Min Soo Park, Bo Hyun Kim
    International Journal of Precision Engineering and Manufacturing.2019; 20(3): 479.     CrossRef
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