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355㎚ UV 레이저를 이용한 구리 박판 가공 시 어블레이션에 관한 연구

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A Study on Laser Ablation of Copper Thin Foil by 355㎚ UV Laser Processing

Jae Yong Oh, Bo Sung Shin
JKSPE 2007;24(2):134-139.
Published online: February 1, 2007
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Usually nanosecond pulsed laser processing of metal is mainly affected by the thermal ablation. Many studies of the theoretical analysis and modeling to predict the laser ablation of metal are suggested on the basis of the photothermal mechanism at higher laser fluence. In this paper, we investigate the etching depth and laser fluence of laser ablation of copper foils and propose the simplified SSB Model(Srinivasan-Smrtic-Babu model) to study the photothermal effect of nanosecond pulsed laser ablation. The experimental results show that the photothermal ablation of the 355㎚ DPSS Nd:YV04 laser is useful to process the copper thin foils.

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A Study on Laser Ablation of Copper Thin Foil by 355㎚ UV Laser Processing
J. Korean Soc. Precis. Eng.. 2007;24(2):134-139.   Published online February 1, 2007
Download Citation

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A Study on Laser Ablation of Copper Thin Foil by 355㎚ UV Laser Processing
J. Korean Soc. Precis. Eng.. 2007;24(2):134-139.   Published online February 1, 2007
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