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JKSPE : Journal of the Korean Society for Precision Engineering

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반도체 칩 캡슐화 성형 공정에 있어서 와이어 스윕 및 패들 변형에 관한 연구

한세진, 허용정, 이성철

A Study of Wire Sweep, Pre-conditioning and Paddle Shift during Encapsulation of Semiconductor Chips

Se-Jin Han, Yong-Jeong Huh, Sung-Cheol Lee
JKSPE 2001;18(2):102-110.
Published online: February 1, 2001
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A Study of Wire Sweep, Pre-conditioning and Paddle Shift during Encapsulation of Semiconductor Chips
J. Korean Soc. Precis. Eng.. 2001;18(2):102-110.   Published online February 1, 2001
Download Citation

Download a citation file in RIS format that can be imported by all major citation management software, including EndNote, ProCite, RefWorks, and Reference Manager.

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A Study of Wire Sweep, Pre-conditioning and Paddle Shift during Encapsulation of Semiconductor Chips
J. Korean Soc. Precis. Eng.. 2001;18(2):102-110.   Published online February 1, 2001
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