Skip to main navigation Skip to main content
  • E-Submission

JKSPE : Journal of the Korean Society for Precision Engineering

OPEN ACCESS
ABOUT
BROWSE ARTICLES
EDITORIAL POLICIES
FOR CONTRIBUTORS
Article

가열에 의한 웨이퍼 형상 변화가 CMP에 미치는 영향

권대희, 김형재, 정해도

Effects of Change of Wafer Shape through Heating on Chemical Mechanical Polishing Process

Dae Hee Kwon, Hyoung Jae Kim, Hae Do Jeong
JKSPE 2003;20(1):85-90.
Published online: January 1, 2003
  • 6 Views
  • 0 Download
  • 0 Crossref
  • 0 Scopus
prev next

Download Citation

Download a citation file in RIS format that can be imported by all major citation management software, including EndNote, ProCite, RefWorks, and Reference Manager.

Format:

Include:

Effects of Change of Wafer Shape through Heating on Chemical Mechanical Polishing Process
J. Korean Soc. Precis. Eng.. 2003;20(1):85-90.   Published online January 1, 2003
Download Citation

Download a citation file in RIS format that can be imported by all major citation management software, including EndNote, ProCite, RefWorks, and Reference Manager.

Format:
Include:
Effects of Change of Wafer Shape through Heating on Chemical Mechanical Polishing Process
J. Korean Soc. Precis. Eng.. 2003;20(1):85-90.   Published online January 1, 2003
Close