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TSV 충진 및 3D 패키징 솔더 범핑 기술

유세훈, 고영기, 신의선, 이창우

Technologies of TSV Filling and Solder Bumping for 3D Packaging

Sehoon Yoo, Young-Ki Ko, Yue-Seon Shin, Chang-Woo Lee
JKSPE 2009;26(12):18-22.
Published online: December 1, 2009



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Technologies of TSV Filling and Solder Bumping for 3D Packaging
J. Korean Soc. Precis. Eng.. 2009;26(12):18-22.   Published online December 1, 2009
Download Citation

Download a citation file in RIS format that can be imported by all major citation management software, including EndNote, ProCite, RefWorks, and Reference Manager.
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Technologies of TSV Filling and Solder Bumping for 3D Packaging
J. Korean Soc. Precis. Eng.. 2009;26(12):18-22.   Published online December 1, 2009
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