In order to achieve and maintain dimensional accuracy in laser micro-machining, dominant parameters such as laser power and laser focus position need to be monitored and controlled real time. Also, in order to selectively machine multi-layered materials, the material being presently machined need to be recognized. This paper presents an auto-focusing (AF) module to keep laser focus on a large-area surface; a real-time laser power stabilizing module based on optical attenuation; and a laser-induced breakdown spectroscopy (LIBS) module. With these monitoring modules, position error in laser focus on a 4” silicon wafer was kept below 4㎛, initially 51㎛, and laser power stability of a UV laser source was improved from 1.6% to 0.3%. Also, the material transition from polyimide to copper in machining of FCCL (flexible copper clad laminate) was successfully observed.
