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미세표면 평활화를 위한 진동 전기화학 폴리싱

김욱수, 김영빈, 박정우

Vibration Electrochemical Polishing for Localized Surface Leveling

Uksu Kim, Youngbin Kim, Jeongwoo Park
JKSPE 2013;30(2):148-153.
Published online: February 1, 2013
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This study demonstrates a novel hybrid surface polishing process combining non-traditional electrochemical polishing(ECP) with external artificial ultrasonic vibration. ECP, typical noncontact surface polishing process, has been used to improve surface quality without leaving any mechanical scratch marks formed by previous mechanical processes, which can polish work material by electrochemical dissolution between two electrodes surfaces. This research suggests vibration electrochemical polishing(VECP) assisted by ultrasonic vibration for enhancing electrochemical reaction and surface quality compared to the conventional ECP. The localized roughness of work material is measured by atomic force microscopy(AFM) for detailed information on surface. Besides roughness, overall surface quality, material removal rate(MRR), and productivity etc. are compared with conventional ECP.

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Vibration Electrochemical Polishing for Localized Surface Leveling
J. Korean Soc. Precis. Eng.. 2013;30(2):148-153.   Published online February 1, 2013
Download Citation

Download a citation file in RIS format that can be imported by all major citation management software, including EndNote, ProCite, RefWorks, and Reference Manager.

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Vibration Electrochemical Polishing for Localized Surface Leveling
J. Korean Soc. Precis. Eng.. 2013;30(2):148-153.   Published online February 1, 2013
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