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Thermal Deformation Analysis of an Orbital Grinding System Grinding Process

이현민, 최우천, 조창래, 조순주

Thermal Deformation Analysis of an Orbital Grinding System Grinding Process

Hyeon Min Lee, Woo Chun Choi, Chang Rae Cho, Soon Ju Cho
JKSPE 2016;33(7):595-600.
Published online: July 1, 2016
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An orbital grinding system uses a special motion to machine crankshafts in ships. When a crankshaft is operated, eccentric pins rotate and a grinding wheel moves in order to grind the pins. Thermal error caused by heat generated in the grinding process decreases the quality of the final product. In this study, the thermal error of an orbital grinding system caused by heat generation was investigated in order to predict the extent of thermal error that can occur during the grinding process. Since the machine position changes during orbital grinding, the pin part is divided into 30 degree intervals and heat is generated. Total thermal error was measured by summing the thermal errors associated with the pin and the grinding wheel. Total thermal error was found to reach a maximum at 60 degrees and a minimum at 210 degrees because of the shape of the crankshaft.

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Thermal Deformation Analysis of an Orbital Grinding System Grinding Process
J. Korean Soc. Precis. Eng.. 2016;33(7):595-600.   Published online July 1, 2016
Download Citation

Download a citation file in RIS format that can be imported by all major citation management software, including EndNote, ProCite, RefWorks, and Reference Manager.

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Thermal Deformation Analysis of an Orbital Grinding System Grinding Process
J. Korean Soc. Precis. Eng.. 2016;33(7):595-600.   Published online July 1, 2016
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