A femtosecond laser is used in various fields such as microscale machining, OLED repair, micro 3D structure fabrication, and eye surgery. Particularly, because of non-thermal property, ablation and ablation threshold are the most representative characteristics of femtosecond laser. The ablation system is accompanied by many optics, stage, or gantry. In the case of the gantry, an ordinary optic system delivers a beam where mirrors and lens are required. If the gantry moves to the sample, external stimulation such as vibration will occur. Vibration has an influence on optics such as transforming beam path and becomes an error that decreases accuracy, precision, and spatial resolution. Generally, Fiber Optic Beam Delivery System (FOBDS) is used to solve this issue. But in the case of the femtosecond laser, FOBDS is incompatible. Recently, another FOBDS model that is compatible with the femtosecond laser has been developed. In this paper, the ablation threshold was obtained by FOBDS and femtosecond laser. The results present a possibility of ablation without external stimulation.

The tungsten carbide is a material with high hardness, wear resistance, good chemical stability, and dimensional stability. Because of these characteristics, it is mainly used as a tool for cutting and molding such as molds, and casts required for manufacturing high value-added equipment such as automobile parts and medical equipment. However, it is difficult to process with the traditional machining methods because of the high toughness and hardness. To overcome these problems, a study of tungsten carbide machining processing using the ultrafast-laser was recently conducted. In this paper, the ultrafast lasers with the pulse duration of 190 fs, 5 and 10 ps, respectively, were used. When the experiments were conducted with pulse widths of 5 and 10 ps, respectively, micro-cracks were observed from the heat generated by the overlap of the laser pulses. Conversely, the machining processing using a laser with the pulse width of 190 fs showed a major advantage with no crack by minimizing the thermal effects.

The purpose of this study is to conduct a comparative analysis of the right shoulder"s muscle activity when lifting ipsilateral and contralateral legs during the Push Up Plus (PUP) exercise, which is a typical shoulder stabilizing exercise, and to provide effective data for a shoulder stabilization exercise. Upper trapezius, lower trapezius, levator scapula, supraspinatus, infraspinatus, deltoid posterior, serratus anterior and pectoralis major, which are eight main muscles of a shoulder, were analyzed for the left and right leg lifting by using an electromyogram (EMG). The study revealed that the muscle activities of the right shoulder"s upper trapezius, levator scapula, supraspinatus, serratus anterior and pectoralis major were higher when lifting an ipsilateral (right side) leg, compared to lifting a contralateral (left side) leg. Therefore, lifting an ipsilateral leg can be an effective method for enhancing the maneuverability (mobility) of the right shoulder when lifting a single leg.

Recent research topics of ultra-precision micro, nano machining using femtosecond lasers are described in the paper.

The removal of tiny particles adhered to surfaces is one of the crucial prerequisite for a further increase in IC fabrication, large area displays and for the process in nanotechnology. Various cleaning techniques (wet chemical cleaning, scrubbing, pressurized jets and ultrasonic processes) currently used to clean critical surfaces are limited to removal of micrometer-sized particles. Therefore the removal of sub-micron sized particles from silicon wafers is of great interest. For this purpose various cleaning methods are currently under investigation. In this paper, we report on experiments on the cleaning effect of 100nm sized fluorescence particles on silicon wafer using the plasma shockwave occurred by femtosecond laser. The plasma shockwave is main effect of femtosecond laser cleaning to remove particles. The removal efficiency was dependent on the gap distance between laser focus and surface but in some case surface was damaged by excessive laser intensity. These experiments demonstrate the feasibility of femtosecond laser cleaning using 100nm size fluorescence particles on wafer.