Visco-Elastic Fracture Analysis of IC Package under Thermal Loading

Kang Yong Lee; Ji Hyuck Yang

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열하중하에 있는 IC 패키지의 점탄성 파괴해석

이강용, 양지혁

Visco-Elastic Fracture Analysis of IC Package under Thermal Loading

Kang Yong Lee, Ji Hyuck Yang

JKSPE 1998;15(1):43-50.

Published online: January 1, 1998

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Visco-Elastic Fracture Analysis of IC Package under Thermal Loading

J. Korean Soc. Precis. Eng.. 1998;15(1):43-50. Published online January 1, 1998

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Visco-Elastic Fracture Analysis of IC Package under Thermal Loading

J. Korean Soc. Precis. Eng.. 1998;15(1):43-50. Published online January 1, 1998

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열하중하에 있는 IC 패키지의 점탄성 파괴해석

Visco-Elastic Fracture Analysis of IC Package under Thermal Loading

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