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플라스틱 IC 패키지의 습열 파괴 해석

이강용, 양지혁

Hygrothermal Cracking Analysis of Plastic IC Package

Kang Yong Lee, Ji Hyuck Yang
JKSPE 1998;15(1):51-59.
Published online: January 1, 1998
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Hygrothermal Cracking Analysis of Plastic IC Package
J. Korean Soc. Precis. Eng.. 1998;15(1):51-59.   Published online January 1, 1998
Download Citation

Download a citation file in RIS format that can be imported by all major citation management software, including EndNote, ProCite, RefWorks, and Reference Manager.

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Hygrothermal Cracking Analysis of Plastic IC Package
J. Korean Soc. Precis. Eng.. 1998;15(1):51-59.   Published online January 1, 1998
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