In this paper, theoretical and experimental studies were conducted on the cooling performance of a microchannel heat dissipation device with a manifold layer added. By adding 500 μm wide microchannels and manifold flow fields, the rheological properties of the cooling fluid were enhanced to improve the heat transfer performance. The size of the microchannel used for cooling was 40 × 40 × 5 mm, and was evaluated under a heat flux of 12.5-43.75 W/㎠ and a flow rate of 0.3-1.1 L /min conditions. As a result of the experiment, in the case of a microchannel heat sink of 500 μm compared to the existing heat sink, cooling was successfully performed under a heat flux condition of about four times

Rubber is positioned as an important material and essential tool and means for mass production of products in all industries due to its unique properties such as sealing, elasticity and shock absorption. However, in the case of conventional press rubber molding, its energy efficiency is low due to considerable heat loss, and the deviation of the temperature distribution of the molding mold is high due to the indirect heating method in which heat is transferred to the upper and lower molds installed on hot plates. The upper and lower heating plates were heated by several heaters installed on the hot plates. The high deviation of the temperature distribution causes unformed defects. Among the rubber mold working methods that consume considerable energy, this study attempted to reduce energy consumption by directly heating the mold via installing a heater inside the upper and lower molds in a compression mold with large energy loss. As a result, compared to the conventional method of transferring heat to the mold by heating the hot plate of the press, energy was saved by 30%, the initial mold heating time was shortened by 20 minutes, and the product defect was reduced with a rate of 25%.

Power electronic systems have been widely applied in both industrial and domestic applications in the modern society for controlling and converting electrical energy. Due to their characteristics, such as excellent performance, low cost, high reliability, and low weight and size, power semiconductors, including insulated-gate bipolar transistors (IGBTs) dominate the market of power converters. The technical progress and development trend of IGBT for industrial applications are primarily driven by five aspects influenced by each other to an extent, including operating temperature, efficiency, dimension, reliability, and cost. Liquid cooling systems surpass the air cooling systems by supplying heat transfer coefficient, which is several orders of magnitude higher. Thus, using liquid cooling system enables much higher power densities of power modules and more compact converter solutions.

The high voltage direct current (HVDC) device has been used to transmit electrical power with an advanced technology of semiconductors. The sustainable energy generation technologies of solar power and windmills are demanding that the HVDCs have high performance and reliability. In this regard, the cooling performance of the HVDC becomes a significant research topic because the temperature increase affects the operation of the device. The evaluation system to assess the cooling performance has been developed and is proposed in this paper. The experimental apparatus is presented in detail. Our experiments have shown the accuracy of flow rates, pressure drops, and the temperatures in the desired measurement points. We have successfully developed an evaluation system of the cooling performance of the HVDC device which has 2.48 kW of heat dissipation.