With the rapid growth of AI and Big Data, reducing energy consumption in data centers has become a significant challenge. Small-scale server rooms, which often depend on standalone cooling units instead of specialized infrastructure, are especially vulnerable to airflow inefficiencies and localized hotspots. While traditional HVAC theory can estimate total cooling loads, it does not effectively predict the local thermal distributions that depend on equipment placement. This study employs Computational Fluid Dynamics (CFD) to address these limitations. It focuses on a server room containing five HPCs and three cooling units, comparing theoretical HVAC calculations with 3D thermal fluid analysis conducted using Ansys Fluent. The research evaluates the thermal performance of the existing layout (Model 1) and suggests an improved configuration (Model 2). The findings reveal that strategic equipment placement can eliminate hotspots and stabilize operations while reducing the necessary cooling capacity. This research provides a practical framework for enhancing energy efficiency in small-scale server environments.
Solid Oxide Fuel Cells (SOFCs) are energy conversion devices known for their significantly higher power density compared to other fuel cell types. However, their high operating temperatures pose challenges related to thermal stability. To address this, research is focusing on Low-Temperature SOFCs (LT-SOFCs), which function at lower temperatures and exhibit enhanced electrochemical performance. While various electrode materials are utilized in SOFCs, platinum (Pt) stands out for its excellent electronic conductivity and catalytic activity. Unfortunately, at the operating temperatures of SOFCs, Pt tends to agglomerate, leading to a rapid reduction in the triple phase boundary (TPB) and a subsequent decline in electrochemical reactions. In this study, LT-SOFCs were fabricated with a Praseodymium Oxide (PrOx) capping layer applied to a porous Pt cathode using sputtering, with various thicknesses achieved by adjusting the deposition time. The electrochemical performance of the LT-SOFCs was measured at 500oC. Additionally, the degradation behavior of the LT-SOFCs was assessed by applying a constant voltage of 0.5 V for 48 hours. Scanning Electron Microscopy (SEM) analysis was also conducted on the PrOx capping layer thin films under the same operating conditions.
This study introduces a novel retainer ring design aimed at mitigating the edge effect during chemical mechanical planarization. The innovative design features an arch-shaped geometry that creates a bending effect, thereby reducing excessive pressure on the wafer's edge. A two-dimensional axisymmetric finite element model was developed, and simulation data were utilized to create a metamodel. Multi-objective optimization was conducted using an evolutionary algorithm, focusing on the normal contact stress on the wafer surface. Representative Pareto-optimal designs were analyzed to assess the distribution of normal contact stresses. The results demonstrated that the proposed design significantly reduced peak normal stresses and enhanced stress uniformity, especially at the wafer edge. This optimized retainer ring is anticipated to improve wafer edge quality and increase semiconductor yield.
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