Hand-arm vibration exposure is a recognized occupational hazard that can cause discomfort and long-term disorders. While anti-vibration gloves are commonly used to reduce these effects, their effectiveness is often limited by the stiffness of the materials and structural constraints. This study focuses on the development and evaluation of polydimethylsiloxane (PDMS)- based anti-vibration layers with varying internal structures for use in anti-vibration gloves. We prepared three types of PDMS layers: solid PDMS without pores (SPDMS), porous PDMS foam created through a sugar-leaching process (FPDMS), and a hybrid PDMS structure that combines solid and porous layers (HPDMS), all shaped like palms. These PDMS layers were integrated into glove specimens, and their vibration transmissibility was assessed using a measurement system compliant with ISO 10819:2013. Vibration transmissibility was recorded across one-third octave bands from 25 to 1,250 Hz, and frequency-weighted transmissibility values were calculated for both the M- and H-spectra. The results indicate that PDMSbased anti-vibration layers with controlled porosity can be effectively fabricated and incorporated into glove structures, and that variations in internal porosity significantly impact the measured vibration transmissibility characteristics.

We present an extrusion-based dispensing system designed for the planar patterning of tungsten ink through direct ink writing. This system achieves uniform ink deposition by precisely controlling the dispensing pressure and the motion of the substrate along predefined writing paths. To assess the impact of pressure on pattern geometry, we fabricated line patterns under various pressure conditions and analyzed their widths and thicknesses. To gain further control over pattern width, we employed an adjacent line overlapping strategy, where several lines, each approximately 200 μm wide, were written with partial overlap. We quantitatively verified the relationship between the number of adjacent lines and the resulting pattern width. This method was also adapted to create planar patterns with complex geometries, including variable widths, curved paths, and discontinuous features. The resulting patterns demonstrated uniform quality and precision. These findings confirm that our proposed system provides a versatile solution for fabricating planar conductive patterns with intricate geometries, suitable for applications in printed electronics and interconnects.